Topcon establishes new R&D company for 3D Inspection Technology in Canada

TOPCON 3D Inspection Laboratories Inc.
October 23, 2009

Topcon Corporation of Tokyo has completed the acquisition of the key technology assets from Aceris 3D Inspection Inc., a world leading developer of technology for 3D measurement and wafer and substrate inspection systems. In conjunction with the purchase, Topcon has formed a new subsidiary corporation, Topcon 3D Inspection Laboratories Inc. This new subsidiary will engage in the research and development of 2D and 3D measurement technology from its offices located in Quebec, Canada.

As part of the expansion of its Finetech Business Unit, Topcon will be increasing its presence in the 3D metrology system market and the cutting-edge substrate inspection business. Topcon will continue to lead the industry with its current Chip Defect Inspection business and Electron Beam Inspection business.

The ideal combination of Topcon’s optics and image processing technology with Aceris’ 3D measurement technology puts Topcon in a unique position to grow the 3D technology and substrate inspection business, launching revolutionary products which are driven by the most advanced technology.

Topcon 3D Inspection Laboratories Inc.
Address : 19501 Clark Graham Baie d’Urfe, Qubec, Canada H9X3T1